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MI16 BGA Reballing Stencil For Redmi K50 K50Pro Note11Pro Note11Pro+ Xiaomi 12Pro Dimensity 8100 9000 MT6895Z MT6983Z CPU PA IC

USD 2.80USD 5.60

MI16 BGA Reballing Stencil For Redmi K50 K50Pro Note11Pro Note11Pro+ Xiaomi 12Pro Dimensity 8100 9000 MT6895Z MT6983Z CPU PA IC

Description
Welcome to our store

 

We specialize in integrated circuit chips

 

If you need to purchase more models

 

Click on the"Add To Cart"

• Shipping Information

 

Items will be ship within3 daysof payment receive.

 

working days(2-4 weeks)to receive for most area.

 

If you do not receive item within 30 working days(5 weeks), please contact us to investigate the case.

 

The soldering process is complicated,oldering/replacing chips must be operated by engineers who have proficient skills.

 

As BGA chips are fragile, complicatedly structured, with numerous balls
any slightly faulty positioning

 

careless temperature-control or incomplete cleaning PCB boards will result in insufficient soldering or missing soldering.

 

BGA chips are easily get broken by improper soldering. Before buying, you should consider 3 points:

 

1) Have you bought the right chips?

 

2) Do you have proper equipment?

 

3) Are you skillful enough to solder the chips?

 

Specification

Certification : CE

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